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Wafer Support Service

Wafer Support Service

Wafer support service for ultra-thinning.

Our company offers a "Wafer Support Service" for ultra-thinning, specializing in integrated processing of polishing, grinding, cleaning, and MEMS processing. Thinned wafers can be delivered in a supported state for integration into the customer's process. Additionally, wafers will be shipped attached to dicing tape. 【Heat & Chemical Resistance】 ■ Heat Resistance: 220℃ for 2 hours, 3 times ■ Chemical Resistance - Acid: Hydrochloric acid for 3 hours - Alkali: 2.38% for 3 hours *For more details, please download the PDF or contact us.

  • Wafer processing/polishing equipment

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